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Part Number | XCZU15EG-3FFVB1156E | Manufacturer | Xilinx |
---|---|---|---|
Description | IC FPGA 328 I/O 1156FCBGA | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Quantity Available | 15 pcs stock | Data sheet | XCZU15EG-3FFVB1156E.pdf |
Supplier Device Package | 1156-FCBGA (35x35) | Speed | 600MHz, 667MHz, 1.5GHz |
Series | Zynq® UltraScale+™ MPSoC EG | RAM Size | 256KB |
Primary Attributes | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | Peripherals | DMA, WDT |
Packaging | Tray | Package / Case | 1156-BBGA, FCBGA |
Operating Temperature | 0°C ~ 100°C (TJ) | Number of I/O | 328 |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Flash Size | - | Detailed Description | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 747K+ Logic Cells 256KB 600MHz, 667MHz, 1.5GHz 1156-FCBGA (35x35) |
Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture | MCU, FPGA |
FEDEX | www.FedEx.com | From $35.00 basic shipping fee depend on zone and country. |
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DHL | www.DHL.com | From $35.00 basic shipping fee depend on zone and country. |
UPS | www.UPS.com | From $35.00 basic shipping fee depend on zone and country. |
TNT | www.TNT.com | From $35.00 basic shipping fee depend on zone and country. |
Part Number | XCZU15EG-3FFVB1156E | Manufacturer | Xilinx |
---|---|---|---|
Description | IC FPGA 328 I/O 1156FCBGA | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Quantity Available | 15 pcs stock | Data sheet | XCZU15EG-3FFVB1156E.pdf |
Supplier Device Package | 1156-FCBGA (35x35) | Speed | 600MHz, 667MHz, 1.5GHz |
Series | Zynq® UltraScale+™ MPSoC EG | RAM Size | 256KB |
Primary Attributes | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | Peripherals | DMA, WDT |
Packaging | Tray | Package / Case | 1156-BBGA, FCBGA |
Operating Temperature | 0°C ~ 100°C (TJ) | Number of I/O | 328 |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Flash Size | - | Detailed Description | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 747K+ Logic Cells 256KB 600MHz, 667MHz, 1.5GHz 1156-FCBGA (35x35) |
Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture | MCU, FPGA |