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XCZU5EG-3FBVB900E

XCZU5EG-3FBVB900E

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Xilinx

Specifications of XCZU5EG-3FBVB900E

Xilinx

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Part Number	XCZU5EG-3FBVB900E	Manufacturer	Xilinx
Description	IC FPGA 204 I/O 900FCBGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	31 pcs stock	Data sheet	1.XCZU5EG-3FBVB900E.pdf2.XCZU5EG-3FBVB900E.pdf3.XCZU5EG-3FBVB900E.pdf4.XCZU5EG-3FBVB900E.pdf
Supplier Device Package	900-FCBGA (31x31)	Speed	600MHz, 1.5GHz
Series	Zynq® UltraScale+™ MPSoC EG	RAM Size	256KB
Primary Attributes	Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	Peripherals	DMA, WDT
Packaging	Tray	Package / Case	900-BBGA, FCBGA
Operating Temperature	0°C ~ 100°C (TJ)	Number of I/O	204
Moisture Sensitivity Level (MSL)	4 (72 Hours)	Manufacturer Standard Lead Time	10 Weeks
Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	-
Detailed Description	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 256K+ Logic Cells 256KB 600MHz, 1.5GHz 900-FCBGA (31x31)	Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Architecture	MCU, FPGA

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• Part Number	XCZU5EG-3FBVB900E	Manufacturer	Xilinx
  Description	IC FPGA 204 I/O 900FCBGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
  Quantity Available	31 pcs stock	Data sheet	1.XCZU5EG-3FBVB900E.pdf2.XCZU5EG-3FBVB900E.pdf3.XCZU5EG-3FBVB900E.pdf4.XCZU5EG-3FBVB900E.pdf
  Supplier Device Package	900-FCBGA (31x31)	Speed	600MHz, 1.5GHz
  Series	Zynq® UltraScale+™ MPSoC EG	RAM Size	256KB
  Primary Attributes	Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	Peripherals	DMA, WDT
  Packaging	Tray	Package / Case	900-BBGA, FCBGA
  Operating Temperature	0°C ~ 100°C (TJ)	Number of I/O	204
  Moisture Sensitivity Level (MSL)	4 (72 Hours)	Manufacturer Standard Lead Time	10 Weeks
  Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	-
  Detailed Description	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 256K+ Logic Cells 256KB 600MHz, 1.5GHz 900-FCBGA (31x31)	Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Architecture	MCU, FPGA

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