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XCZU3CG-1SFVC784E

XCZU3CG-1SFVC784E

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Xilinx

Part Number:: XCZU3CG-1SFVC784E

Manufacturer/Brand:: Xilinx

Product Description:: XCZU3CG-1SFVC784E

Datasheets:: 1.XCZU3CG-1SFVC784E.pdf 2.XCZU3CG-1SFVC784E.pdf

RoHs Status:: Lead free / RoHS Compliant

Stock Condition:: 242 pcs stock

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Shipment Way:: DHL/Fedex/TNT/UPS/EMS

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In Stock 242 pcs Reference Price(In US Dollars)

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Specifications of XCZU3CG-1SFVC784E

Xilinx

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Part Number	XCZU3CG-1SFVC784E	Manufacturer	Xilinx
Description	XCZU3CG-1SFVC784E	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	242 pcs stock	Data sheet	1.XCZU3CG-1SFVC784E.pdf 2.XCZU3CG-1SFVC784E.pdf
Supplier Device Package	784-FCBGA (23x23)	Speed	500MHz, 1.2GHz
Series	Zynq® UltraScale+™ MPSoC CG	RAM Size	256KB
Primary Attributes	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	Peripherals	DMA, WDT
Packaging	Tray	Package / Case	784-BBGA, FCBGA
Operating Temperature	0°C ~ 100°C (TJ)	Number of I/O	252
Moisture Sensitivity Level (MSL)	4 (72 Hours)	Manufacturer Standard Lead Time	10 Weeks
Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	-
Detailed Description	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 256KB 500MHz, 1.2GHz 784-FCBGA (23x23)	Core Processor	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Architecture	MCU, FPGA

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Part Number	XCZU3CG-1SFVC784E	Manufacturer	Xilinx
Description	XCZU3CG-1SFVC784E	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	242 pcs stock	Data sheet	1.XCZU3CG-1SFVC784E.pdf 2.XCZU3CG-1SFVC784E.pdf
Supplier Device Package	784-FCBGA (23x23)	Speed	500MHz, 1.2GHz
Series	Zynq® UltraScale+™ MPSoC CG	RAM Size	256KB
Primary Attributes	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	Peripherals	DMA, WDT
Packaging	Tray	Package / Case	784-BBGA, FCBGA
Operating Temperature	0°C ~ 100°C (TJ)	Number of I/O	252
Moisture Sensitivity Level (MSL)	4 (72 Hours)	Manufacturer Standard Lead Time	10 Weeks
Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	-
Detailed Description	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 256KB 500MHz, 1.2GHz 784-FCBGA (23x23)	Core Processor	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Architecture	MCU, FPGA