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XCZU6EG-3FFVB1156E

XCZU6EG-3FFVB1156E

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Xilinx

Part Number:: XCZU6EG-3FFVB1156E

Manufacturer/Brand:: Xilinx

Product Description:: IC FPGA 328 I/O 1156FCBGA

Datasheets:: 1.XCZU6EG-3FFVB1156E.pdf 2.XCZU6EG-3FFVB1156E.pdf 3.XCZU6EG-3FFVB1156E.pdf 4.XCZU6EG-3FFVB1156E.pdf

RoHs Status:: Lead free / RoHS Compliant

Stock Condition:: 24 pcs stock

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In Stock 24 pcs Reference Price(In US Dollars)

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XCZU6EG-3FFVB1156E

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Specifications of XCZU6EG-3FFVB1156E

Xilinx

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Part Number	XCZU6EG-3FFVB1156E	Manufacturer	Xilinx
Description	IC FPGA 328 I/O 1156FCBGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	24 pcs stock	Data sheet	1.XCZU6EG-3FFVB1156E.pdf 2.XCZU6EG-3FFVB1156E.pdf 3.XCZU6EG-3FFVB1156E.pdf 4.XCZU6EG-3FFVB1156E.pdf
Supplier Device Package	1156-FCBGA (35x35)	Speed	600MHz, 1.5GHz
Series	Zynq® UltraScale+™ MPSoC EG	RAM Size	256KB
Primary Attributes	Zynq®UltraScale+™ FPGA, 469K+ Logic Cells	Peripherals	DMA, WDT
Packaging	Tray	Package / Case	1156-BBGA, FCBGA
Operating Temperature	0°C ~ 100°C (TJ)	Number of I/O	328
Moisture Sensitivity Level (MSL)	4 (72 Hours)	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Flash Size	-	Detailed Description	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 469K+ Logic Cells 256KB 600MHz, 1.5GHz 1156-FCBGA (35x35)
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA

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Part Number	XCZU6EG-3FFVB1156E	Manufacturer	Xilinx
Description	IC FPGA 328 I/O 1156FCBGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	24 pcs stock	Data sheet	1.XCZU6EG-3FFVB1156E.pdf 2.XCZU6EG-3FFVB1156E.pdf 3.XCZU6EG-3FFVB1156E.pdf 4.XCZU6EG-3FFVB1156E.pdf
Supplier Device Package	1156-FCBGA (35x35)	Speed	600MHz, 1.5GHz
Series	Zynq® UltraScale+™ MPSoC EG	RAM Size	256KB
Primary Attributes	Zynq®UltraScale+™ FPGA, 469K+ Logic Cells	Peripherals	DMA, WDT
Packaging	Tray	Package / Case	1156-BBGA, FCBGA
Operating Temperature	0°C ~ 100°C (TJ)	Number of I/O	328
Moisture Sensitivity Level (MSL)	4 (72 Hours)	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Flash Size	-	Detailed Description	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 469K+ Logic Cells 256KB 600MHz, 1.5GHz 1156-FCBGA (35x35)
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA