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XA7Z030-1FBV484Q

XA7Z030-1FBV484Q

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Xilinx

Specifications of XA7Z030-1FBV484Q

Xilinx

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Part Number	XA7Z030-1FBV484Q	Manufacturer	Xilinx
Description	VIRTEX-7 FBGA BLOCK 484BGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	284 pcs stock	Data sheet	1.XA7Z030-1FBV484Q.pdf2.XA7Z030-1FBV484Q.pdf
Supplier Device Package	484-FCBGA (23x23)	Speed	667MHz
Series	Automotive, AEC-Q100, Zynq®-7000 XA	RAM Size	256KB
Primary Attributes	Kintex™-7 FPGA, 125K Logic Cells	Peripherals	DMA
Packaging	Tray	Package / Case	484-BBGA, FCBGA
Operating Temperature	-40°C ~ 125°C (TJ)	Number of I/O	130
Moisture Sensitivity Level (MSL)	4 (72 Hours)	Manufacturer Standard Lead Time	10 Weeks
Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	-
Detailed Description	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Automotive, AEC-Q100, Zynq®-7000 XA Kintex™-7 FPGA, 125K Logic Cells 256KB 667MHz 484-FCBGA (23x23)	Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Architecture	MCU, FPGA

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• Part Number	XA7Z030-1FBV484Q	Manufacturer	Xilinx
  Description	VIRTEX-7 FBGA BLOCK 484BGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
  Quantity Available	284 pcs stock	Data sheet	1.XA7Z030-1FBV484Q.pdf2.XA7Z030-1FBV484Q.pdf
  Supplier Device Package	484-FCBGA (23x23)	Speed	667MHz
  Series	Automotive, AEC-Q100, Zynq®-7000 XA	RAM Size	256KB
  Primary Attributes	Kintex™-7 FPGA, 125K Logic Cells	Peripherals	DMA
  Packaging	Tray	Package / Case	484-BBGA, FCBGA
  Operating Temperature	-40°C ~ 125°C (TJ)	Number of I/O	130
  Moisture Sensitivity Level (MSL)	4 (72 Hours)	Manufacturer Standard Lead Time	10 Weeks
  Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	-
  Detailed Description	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Automotive, AEC-Q100, Zynq®-7000 XA Kintex™-7 FPGA, 125K Logic Cells 256KB 667MHz 484-FCBGA (23x23)	Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Architecture	MCU, FPGA

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