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M2S060TS-1FGG676T2

M2S060TS-1FGG676T2

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Microsemi

Part Number:: M2S060TS-1FGG676T2

Manufacturer/Brand:: Microsemi

Product Description:: IC FPGA SOC

Datasheets:: 1.M2S060TS-1FGG676T2.pdf 2.M2S060TS-1FGG676T2.pdf 3.M2S060TS-1FGG676T2.pdf 4.M2S060TS-1FGG676T2.pdf 5.M2S060TS-1FGG676T2.pdf 6.M2S060TS-1FGG676T2.pdf 7.M2S060TS-1FGG676T2.pdf 8.M2S060TS-1FGG676T2.pdf

RoHs Status:: Lead free / RoHS Compliant

Stock Condition:: 468 pcs stock

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In Stock 468 pcs Reference Price(In US Dollars)

40 pcs
$63.785

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M2S060TS-1FGG676T2

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Specifications of M2S060TS-1FGG676T2

Microsemi

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Part Number	M2S060TS-1FGG676T2	Manufacturer	Microsemi
Description	IC FPGA SOC	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	468 pcs stock	Data sheet	1.M2S060TS-1FGG676T2.pdf 2.M2S060TS-1FGG676T2.pdf 3.M2S060TS-1FGG676T2.pdf 4.M2S060TS-1FGG676T2.pdf 5.M2S060TS-1FGG676T2.pdf 6.M2S060TS-1FGG676T2.pdf 7.M2S060TS-1FGG676T2.pdf 8.M2S060TS-1FGG676T2.pdf
Supplier Device Package	676-FBGA (27x27)	Speed	166MHz
Series	Automotive, AEC-Q100, SmartFusion®2	RAM Size	64KB
Primary Attributes	FPGA - 60K Logic Modules	Peripherals	DDR, PCIe, SERDES
Packaging	Tray	Package / Case	676-BGA
Operating Temperature	-40°C ~ 125°C (TJ)	Number of I/O	387
Moisture Sensitivity Level (MSL)	3 (168 Hours)	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Flash Size	256KB	Detailed Description	ARM® Cortex®-M3 System On Chip (SOC) IC Automotive, AEC-Q100, SmartFusion®2 FPGA - 60K Logic Modules 256KB 64KB 166MHz 676-FBGA (27x27)
Core Processor	ARM® Cortex®-M3	Connectivity	CANbus, Ethernet, I²C, SPI, UART/USART, USB
Architecture	MCU, FPGA

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Part Number	M2S060TS-1FGG676T2	Manufacturer	Microsemi
Description	IC FPGA SOC	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	468 pcs stock	Data sheet	1.M2S060TS-1FGG676T2.pdf 2.M2S060TS-1FGG676T2.pdf 3.M2S060TS-1FGG676T2.pdf 4.M2S060TS-1FGG676T2.pdf 5.M2S060TS-1FGG676T2.pdf 6.M2S060TS-1FGG676T2.pdf 7.M2S060TS-1FGG676T2.pdf 8.M2S060TS-1FGG676T2.pdf
Supplier Device Package	676-FBGA (27x27)	Speed	166MHz
Series	Automotive, AEC-Q100, SmartFusion®2	RAM Size	64KB
Primary Attributes	FPGA - 60K Logic Modules	Peripherals	DDR, PCIe, SERDES
Packaging	Tray	Package / Case	676-BGA
Operating Temperature	-40°C ~ 125°C (TJ)	Number of I/O	387
Moisture Sensitivity Level (MSL)	3 (168 Hours)	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Flash Size	256KB	Detailed Description	ARM® Cortex®-M3 System On Chip (SOC) IC Automotive, AEC-Q100, SmartFusion®2 FPGA - 60K Logic Modules 256KB 64KB 166MHz 676-FBGA (27x27)
Core Processor	ARM® Cortex®-M3	Connectivity	CANbus, Ethernet, I²C, SPI, UART/USART, USB
Architecture	MCU, FPGA