Please complete all required fields with your contact information.Click "SUBMIT RFQ"
we will contact you shortly by email. Or Email us:info@pss-electrocomponents.com
Part Number | XCZU7EV-3FBVB900E | Manufacturer | Xilinx |
---|---|---|---|
Description | IC FPGA 204 I/O 900FCBGA | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Quantity Available | 23 pcs stock | Data sheet | 1.XCZU7EV-3FBVB900E.pdf2.XCZU7EV-3FBVB900E.pdf3.XCZU7EV-3FBVB900E.pdf4.XCZU7EV-3FBVB900E.pdf |
Supplier Device Package | 900-FCBGA (31x31) | Speed | 600MHz, 1.5GHz |
Series | Zynq® UltraScale+™ MPSoC EV | RAM Size | 256KB |
Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | Peripherals | DMA, WDT |
Packaging | Tray | Package / Case | 900-BBGA, FCBGA |
Operating Temperature | 0°C ~ 100°C (TJ) | Number of I/O | 204 |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) | Manufacturer Standard Lead Time | 10 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | Flash Size | - |
Detailed Description | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EV Zynq®UltraScale+™ FPGA, 504K+ Logic Cells 256KB 600MHz, 1.5GHz 900-FCBGA (31x31) | Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Architecture | MCU, FPGA |
FEDEX | www.FedEx.com | From $35.00 basic shipping fee depend on zone and country. |
---|---|---|
DHL | www.DHL.com | From $35.00 basic shipping fee depend on zone and country. |
UPS | www.UPS.com | From $35.00 basic shipping fee depend on zone and country. |
TNT | www.TNT.com | From $35.00 basic shipping fee depend on zone and country. |
Part Number | XCZU7EV-3FBVB900E | Manufacturer | Xilinx |
---|---|---|---|
Description | IC FPGA 204 I/O 900FCBGA | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Quantity Available | 23 pcs stock | Data sheet | 1.XCZU7EV-3FBVB900E.pdf2.XCZU7EV-3FBVB900E.pdf3.XCZU7EV-3FBVB900E.pdf4.XCZU7EV-3FBVB900E.pdf |
Supplier Device Package | 900-FCBGA (31x31) | Speed | 600MHz, 1.5GHz |
Series | Zynq® UltraScale+™ MPSoC EV | RAM Size | 256KB |
Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | Peripherals | DMA, WDT |
Packaging | Tray | Package / Case | 900-BBGA, FCBGA |
Operating Temperature | 0°C ~ 100°C (TJ) | Number of I/O | 204 |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) | Manufacturer Standard Lead Time | 10 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | Flash Size | - |
Detailed Description | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EV Zynq®UltraScale+™ FPGA, 504K+ Logic Cells 256KB 600MHz, 1.5GHz 900-FCBGA (31x31) | Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Architecture | MCU, FPGA |