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A2F500M3G-1FGG256M

A2F500M3G-1FGG256M

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Microsemi

Specifications of A2F500M3G-1FGG256M

Microsemi

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Part Number	A2F500M3G-1FGG256M	Manufacturer	Microsemi
Description	IC FPGA 500K GATES 512KB 256FBGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	156 pcs stock	Data sheet	A2F500M3G-1FGG256M.pdf
Supplier Device Package	256-FBGA (17x17)	Speed	100MHz
Series	SmartFusion®	RAM Size	64KB
Primary Attributes	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	Peripherals	DMA, POR, WDT
Packaging	Tray	Package / Case	256-LBGA
Operating Temperature	-55°C ~ 125°C (TJ)	Number of I/O	MCU - 25, FPGA - 66
Moisture Sensitivity Level (MSL)	3 (168 Hours)	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Flash Size	512KB	Detailed Description	ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops 512KB 64KB 100MHz 256-FBGA (17x17)
Core Processor	ARM® Cortex®-M3	Connectivity	EBI/EMI, Ethernet, I²C, SPI, UART/USART
Base Part Number	A2F500M3G	Architecture	MCU, FPGA

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• Part Number	A2F500M3G-1FGG256M	Manufacturer	Microsemi
  Description	IC FPGA 500K GATES 512KB 256FBGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
  Quantity Available	156 pcs stock	Data sheet	A2F500M3G-1FGG256M.pdf
  Supplier Device Package	256-FBGA (17x17)	Speed	100MHz
  Series	SmartFusion®	RAM Size	64KB
  Primary Attributes	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	Peripherals	DMA, POR, WDT
  Packaging	Tray	Package / Case	256-LBGA
  Operating Temperature	-55°C ~ 125°C (TJ)	Number of I/O	MCU - 25, FPGA - 66
  Moisture Sensitivity Level (MSL)	3 (168 Hours)	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
  Flash Size	512KB	Detailed Description	ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops 512KB 64KB 100MHz 256-FBGA (17x17)
  Core Processor	ARM® Cortex®-M3	Connectivity	EBI/EMI, Ethernet, I²C, SPI, UART/USART
  Base Part Number	A2F500M3G	Architecture	MCU, FPGA

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