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5CSEBA2U23C7SN

5CSEBA2U23C7SN

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Intel® FPGAs

Specifications of 5CSEBA2U23C7SN

Intel® FPGAs

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Part Number	5CSEBA2U23C7SN	Manufacturer	Intel® FPGAs
Description	IC FPGA 188 I/O 672UBGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	1114 pcs stock	Data sheet	1.5CSEBA2U23C7SN.pdf2.5CSEBA2U23C7SN.pdf3.5CSEBA2U23C7SN.pdf4.5CSEBA2U23C7SN.pdf
Supplier Device Package	672-UBGA (23x23)	Speed	800MHz
Series	Cyclone® V SE	RAM Size	64KB
Primary Attributes	FPGA - 25K Logic Elements	Peripherals	DMA, POR, WDT
Packaging	Tray	Package / Case	672-FBGA
Operating Temperature	0°C ~ 85°C (TJ)	Number of I/O	MCU - 181, FPGA - 145
Moisture Sensitivity Level (MSL)	3 (168 Hours)	Manufacturer Standard Lead Time	15 Weeks
Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	-
Detailed Description	Single ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Cyclone® V SE FPGA - 25K Logic Elements 64KB 800MHz 672-UBGA (23x23)	Core Processor	Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Architecture	MCU, FPGA

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• Part Number	5CSEBA2U23C7SN	Manufacturer	Intel® FPGAs
  Description	IC FPGA 188 I/O 672UBGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
  Quantity Available	1114 pcs stock	Data sheet	1.5CSEBA2U23C7SN.pdf2.5CSEBA2U23C7SN.pdf3.5CSEBA2U23C7SN.pdf4.5CSEBA2U23C7SN.pdf
  Supplier Device Package	672-UBGA (23x23)	Speed	800MHz
  Series	Cyclone® V SE	RAM Size	64KB
  Primary Attributes	FPGA - 25K Logic Elements	Peripherals	DMA, POR, WDT
  Packaging	Tray	Package / Case	672-FBGA
  Operating Temperature	0°C ~ 85°C (TJ)	Number of I/O	MCU - 181, FPGA - 145
  Moisture Sensitivity Level (MSL)	3 (168 Hours)	Manufacturer Standard Lead Time	15 Weeks
  Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	-
  Detailed Description	Single ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Cyclone® V SE FPGA - 25K Logic Elements 64KB 800MHz 672-UBGA (23x23)	Core Processor	Single ARM® Cortex®-A9 MPCore™ with CoreSight™
  Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Architecture	MCU, FPGA

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