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XCZU9EG-3FFVC900E

XCZU9EG-3FFVC900E

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Xilinx

Part Number:: XCZU9EG-3FFVC900E

Manufacturer/Brand:: Xilinx

Product Description:: IC FPGA 204 I/O 900FCBGA

Datasheets:: 1.XCZU9EG-3FFVC900E.pdf 2.XCZU9EG-3FFVC900E.pdf 3.XCZU9EG-3FFVC900E.pdf 4.XCZU9EG-3FFVC900E.pdf

RoHs Status:: Lead free / RoHS Compliant

Stock Condition:: 21 pcs stock

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In Stock 21 pcs Reference Price(In US Dollars)

1 pcs
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XCZU9EG-3FFVC900E

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Specifications of XCZU9EG-3FFVC900E

Xilinx

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Part Number	XCZU9EG-3FFVC900E	Manufacturer	Xilinx
Description	IC FPGA 204 I/O 900FCBGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	21 pcs stock	Data sheet	1.XCZU9EG-3FFVC900E.pdf 2.XCZU9EG-3FFVC900E.pdf 3.XCZU9EG-3FFVC900E.pdf 4.XCZU9EG-3FFVC900E.pdf
Supplier Device Package	900-FCBGA (31x31)	Speed	600MHz, 1.5GHz
Series	Zynq® UltraScale+™ MPSoC EG	RAM Size	256KB
Primary Attributes	Zynq®UltraScale+™ FPGA, 599K+ Logic Cells	Peripherals	DMA, WDT
Packaging	Tray	Package / Case	900-BBGA, FCBGA
Operating Temperature	0°C ~ 100°C (TJ)	Number of I/O	204
Moisture Sensitivity Level (MSL)	4 (72 Hours)	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Flash Size	-	Detailed Description	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 256KB 600MHz, 1.5GHz 900-FCBGA (31x31)
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA

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Part Number	XCZU9EG-3FFVC900E	Manufacturer	Xilinx
Description	IC FPGA 204 I/O 900FCBGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	21 pcs stock	Data sheet	1.XCZU9EG-3FFVC900E.pdf 2.XCZU9EG-3FFVC900E.pdf 3.XCZU9EG-3FFVC900E.pdf 4.XCZU9EG-3FFVC900E.pdf
Supplier Device Package	900-FCBGA (31x31)	Speed	600MHz, 1.5GHz
Series	Zynq® UltraScale+™ MPSoC EG	RAM Size	256KB
Primary Attributes	Zynq®UltraScale+™ FPGA, 599K+ Logic Cells	Peripherals	DMA, WDT
Packaging	Tray	Package / Case	900-BBGA, FCBGA
Operating Temperature	0°C ~ 100°C (TJ)	Number of I/O	204
Moisture Sensitivity Level (MSL)	4 (72 Hours)	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Flash Size	-	Detailed Description	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 256KB 600MHz, 1.5GHz 900-FCBGA (31x31)
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA