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A2F500M3G-FGG256

A2F500M3G-FGG256

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Microsemi

Specifications of A2F500M3G-FGG256

Microsemi

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Part Number	A2F500M3G-FGG256	Manufacturer	Microsemi
Description	IC FPGA 512K FLASH 256FBGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	5112 pcs stock	Data sheet	A2F500M3G-FGG256.pdf
Supplier Device Package	256-FBGA (17x17)	Speed	80MHz
Series	SmartFusion®	RAM Size	64KB
Primary Attributes	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	Peripherals	DMA, POR, WDT
Packaging	Tray	Package / Case	256-LBGA
Other Names	1100-1009 A2F500M3GFGG256	Operating Temperature	0°C ~ 85°C (TJ)
Number of I/O	MCU - 25, FPGA - 66	Moisture Sensitivity Level (MSL)	3 (168 Hours)
Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	512KB
Detailed Description	ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops 512KB 64KB 80MHz 256-FBGA (17x17)	Core Processor	ARM® Cortex®-M3
Connectivity	EBI/EMI, Ethernet, I²C, SPI, UART/USART	Base Part Number	A2F500M3G
Architecture	MCU, FPGA

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• Part Number	A2F500M3G-FGG256	Manufacturer	Microsemi
  Description	IC FPGA 512K FLASH 256FBGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
  Quantity Available	5112 pcs stock	Data sheet	A2F500M3G-FGG256.pdf
  Supplier Device Package	256-FBGA (17x17)	Speed	80MHz
  Series	SmartFusion®	RAM Size	64KB
  Primary Attributes	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	Peripherals	DMA, POR, WDT
  Packaging	Tray	Package / Case	256-LBGA
  Other Names	1100-1009 A2F500M3GFGG256	Operating Temperature	0°C ~ 85°C (TJ)
  Number of I/O	MCU - 25, FPGA - 66	Moisture Sensitivity Level (MSL)	3 (168 Hours)
  Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	512KB
  Detailed Description	ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops 512KB 64KB 80MHz 256-FBGA (17x17)	Core Processor	ARM® Cortex®-M3
  Connectivity	EBI/EMI, Ethernet, I²C, SPI, UART/USART	Base Part Number	A2F500M3G
  Architecture	MCU, FPGA

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