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XC7Z035-2FFG900I

XC7Z035-2FFG900I

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Xilinx

Specifications of XC7Z035-2FFG900I

Xilinx

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Part Number	XC7Z035-2FFG900I	Manufacturer	Xilinx
Description	IC SOC CORTEX-A9 KINTEX7 900BGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	51 pcs stock	Data sheet	1.XC7Z035-2FFG900I.pdf2.XC7Z035-2FFG900I.pdf3.XC7Z035-2FFG900I.pdf
Supplier Device Package	900-FCBGA (31x31)	Speed	800MHz
Series	Zynq®-7000	RAM Size	256KB
Primary Attributes	Kintex™-7 FPGA, 275K Logic Cells	Peripherals	DMA
Packaging	Tray	Package / Case	900-BBGA, FCBGA
Other Names	122-2176 XC7Z035-2FFG900I-ND	Operating Temperature	-40°C ~ 100°C (TJ)
Number of I/O	130	Moisture Sensitivity Level (MSL)	4 (72 Hours)
Manufacturer Standard Lead Time	10 Weeks	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Flash Size	-	Detailed Description	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 275K Logic Cells 256KB 800MHz 900-FCBGA (31x31)
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA

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• Part Number	XC7Z035-2FFG900I	Manufacturer	Xilinx
  Description	IC SOC CORTEX-A9 KINTEX7 900BGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
  Quantity Available	51 pcs stock	Data sheet	1.XC7Z035-2FFG900I.pdf2.XC7Z035-2FFG900I.pdf3.XC7Z035-2FFG900I.pdf
  Supplier Device Package	900-FCBGA (31x31)	Speed	800MHz
  Series	Zynq®-7000	RAM Size	256KB
  Primary Attributes	Kintex™-7 FPGA, 275K Logic Cells	Peripherals	DMA
  Packaging	Tray	Package / Case	900-BBGA, FCBGA
  Other Names	122-2176 XC7Z035-2FFG900I-ND	Operating Temperature	-40°C ~ 100°C (TJ)
  Number of I/O	130	Moisture Sensitivity Level (MSL)	4 (72 Hours)
  Manufacturer Standard Lead Time	10 Weeks	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
  Flash Size	-	Detailed Description	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 275K Logic Cells 256KB 800MHz 900-FCBGA (31x31)
  Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  Architecture	MCU, FPGA

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