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X66AK2H06AAW24

X66AK2H06AAW24

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Part Number:: X66AK2H06AAW24

Manufacturer/Brand:: N/A

Product Description:: IC DSP ARM SOC BGA

Datasheets:: X66AK2H06AAW24

RoHs Status:: Contains lead / RoHS non-compliant

Stock Condition:: 4719 pcs stock

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Shipment Way:: DHL/Fedex/TNT/UPS/EMS

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X66AK2H06AAW24

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Specifications of X66AK2H06AAW24

X66AK2H06AAW24

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Part Number	X66AK2H06AAW24	Manufacturer	N/A
Description	IC DSP ARM SOC BGA	Lead Free Status / RoHS Status	Contains lead / RoHS non-compliant
Quantity Available	4719 pcs stock	Data sheet
Voltage - I/O	0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V	Voltage - Core	Variable
Type	DSP+ARM®	Supplier Device Package	1517-FCBGA (40x40)
Series	66AK2Hx KeyStone Multicore	Packaging	Tray
Package / Case	1517-BBGA, FCBGA	Operating Temperature	0°C ~ 85°C (TC)
On-Chip RAM	8.375MB	Non-Volatile Memory	ROM (384 kB)
Mounting Type	Surface Mount	Moisture Sensitivity Level (MSL)	3 (168 Hours)
Lead Free Status / RoHS Status	Contains lead / RoHS non-compliant	Interface	EBI/EMI, Ethernet, DMA, I²C, Serial RapidIO, SPI, UART/USART, USB 3.0
Clock Rate	1.2GHz DSP, 1.4GHz ARM®	Base Part Number	66AK2H06

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Part Number	X66AK2H06AAW24	Manufacturer	N/A
Description	IC DSP ARM SOC BGA	Lead Free Status / RoHS Status	Contains lead / RoHS non-compliant
Quantity Available	4719 pcs stock	Data sheet
Voltage - I/O	0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V	Voltage - Core	Variable
Type	DSP+ARM®	Supplier Device Package	1517-FCBGA (40x40)
Series	66AK2Hx KeyStone Multicore	Packaging	Tray
Package / Case	1517-BBGA, FCBGA	Operating Temperature	0°C ~ 85°C (TC)
On-Chip RAM	8.375MB	Non-Volatile Memory	ROM (384 kB)
Mounting Type	Surface Mount	Moisture Sensitivity Level (MSL)	3 (168 Hours)
Lead Free Status / RoHS Status	Contains lead / RoHS non-compliant	Interface	EBI/EMI, Ethernet, DMA, I²C, Serial RapidIO, SPI, UART/USART, USB 3.0
Clock Rate	1.2GHz DSP, 1.4GHz ARM®	Base Part Number	66AK2H06