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X66AK2E05XABD25

X66AK2E05XABD25

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Specifications of X66AK2E05XABD25

X66AK2E05XABD25

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Part Number	X66AK2E05XABD25	Manufacturer	N/A
Description	IC DSP ARM SOC BGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	5466 pcs stock	Data sheet
Voltage - I/O	1.35V, 1.5V, 1.8V, 3.3V	Voltage - Core	Variable
Type	DSP+ARM®	Supplier Device Package	1089-FCBGA (27x27)
Series	66AK2Ex KeyStone Multicore	Packaging	Tray
Package / Case	1089-BFBGA, FCBGA	Other Names	296-43484-5 X66AK2E05XABD25-ND
Operating Temperature	0°C ~ 85°C (TC)	On-Chip RAM	2MB
Non-Volatile Memory	ROM (256 kB)	Mounting Type	Surface Mount
Moisture Sensitivity Level (MSL)	2A (4 Weeks)	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Interface	EBI/EMI, Ethernet, DMA, I²C, PCIe, SPI, TSIP, UART, USB 3.0, USIM	Clock Rate	1.25GHz

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• Part Number	X66AK2E05XABD25	Manufacturer	N/A
  Description	IC DSP ARM SOC BGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
  Quantity Available	5466 pcs stock	Data sheet
  Voltage - I/O	1.35V, 1.5V, 1.8V, 3.3V	Voltage - Core	Variable
  Type	DSP+ARM®	Supplier Device Package	1089-FCBGA (27x27)
  Series	66AK2Ex KeyStone Multicore	Packaging	Tray
  Package / Case	1089-BFBGA, FCBGA	Other Names	296-43484-5 X66AK2E05XABD25-ND
  Operating Temperature	0°C ~ 85°C (TC)	On-Chip RAM	2MB
  Non-Volatile Memory	ROM (256 kB)	Mounting Type	Surface Mount
  Moisture Sensitivity Level (MSL)	2A (4 Weeks)	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
  Interface	EBI/EMI, Ethernet, DMA, I²C, PCIe, SPI, TSIP, UART, USB 3.0, USIM	Clock Rate	1.25GHz

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