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A2F200M3F-1PQG208

A2F200M3F-1PQG208

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Microsemi

Specifications of A2F200M3F-1PQG208

Microsemi

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Part Number	A2F200M3F-1PQG208	Manufacturer	Microsemi
Description	IC FPGA 256K FLASH 208QFP	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	4608 pcs stock	Data sheet	A2F200M3F-1PQG208.pdf
Supplier Device Package	208-PQFP (28x28)	Speed	100MHz
Series	SmartFusion®	RAM Size	64KB
Primary Attributes	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	Peripherals	DMA, POR, WDT
Packaging	Tray	Package / Case	208-BFQFP
Other Names	1100-1002 A2F200M3F1PQG208	Operating Temperature	0°C ~ 85°C (TJ)
Number of I/O	MCU - 22, FPGA - 66	Moisture Sensitivity Level (MSL)	3 (168 Hours)
Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	256KB
Detailed Description	ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 256KB 64KB 100MHz 208-PQFP (28x28)	Core Processor	ARM® Cortex®-M3
Connectivity	EBI/EMI, Ethernet, I²C, SPI, UART/USART	Base Part Number	A2F200
Architecture	MCU, FPGA

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• Part Number	A2F200M3F-1PQG208	Manufacturer	Microsemi
  Description	IC FPGA 256K FLASH 208QFP	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
  Quantity Available	4608 pcs stock	Data sheet	A2F200M3F-1PQG208.pdf
  Supplier Device Package	208-PQFP (28x28)	Speed	100MHz
  Series	SmartFusion®	RAM Size	64KB
  Primary Attributes	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	Peripherals	DMA, POR, WDT
  Packaging	Tray	Package / Case	208-BFQFP
  Other Names	1100-1002 A2F200M3F1PQG208	Operating Temperature	0°C ~ 85°C (TJ)
  Number of I/O	MCU - 22, FPGA - 66	Moisture Sensitivity Level (MSL)	3 (168 Hours)
  Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	256KB
  Detailed Description	ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 256KB 64KB 100MHz 208-PQFP (28x28)	Core Processor	ARM® Cortex®-M3
  Connectivity	EBI/EMI, Ethernet, I²C, SPI, UART/USART	Base Part Number	A2F200
  Architecture	MCU, FPGA

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