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A2F500M3G-1FG256I

A2F500M3G-1FG256I

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Microsemi

Specifications of A2F500M3G-1FG256I

Microsemi

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Part Number	A2F500M3G-1FG256I	Manufacturer	Microsemi
Description	IC FPGA 500K GATES 512KB 256-BGA	Lead Free Status / RoHS Status	Contains lead / RoHS non-compliant
Quantity Available	5612 pcs stock	Data sheet	A2F500M3G-1FG256I.pdf
Supplier Device Package	256-FPBGA (17x17)	Speed	100MHz
Series	SmartFusion®	RAM Size	64KB
Primary Attributes	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	Peripherals	DMA, POR, WDT
Packaging	Tray	Package / Case	256-LBGA
Operating Temperature	-40°C ~ 100°C (TJ)	Number of I/O	MCU - 25, FPGA - 66
Moisture Sensitivity Level (MSL)	3 (168 Hours)	Lead Free Status / RoHS Status	Contains lead / RoHS non-compliant
Flash Size	512KB	Detailed Description	ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops 512KB 64KB 100MHz 256-FPBGA (17x17)
Core Processor	ARM® Cortex®-M3	Connectivity	EBI/EMI, Ethernet, I²C, SPI, UART/USART
Base Part Number	A2F500M3G	Architecture	MCU, FPGA

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• Part Number	A2F500M3G-1FG256I	Manufacturer	Microsemi
  Description	IC FPGA 500K GATES 512KB 256-BGA	Lead Free Status / RoHS Status	Contains lead / RoHS non-compliant
  Quantity Available	5612 pcs stock	Data sheet	A2F500M3G-1FG256I.pdf
  Supplier Device Package	256-FPBGA (17x17)	Speed	100MHz
  Series	SmartFusion®	RAM Size	64KB
  Primary Attributes	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	Peripherals	DMA, POR, WDT
  Packaging	Tray	Package / Case	256-LBGA
  Operating Temperature	-40°C ~ 100°C (TJ)	Number of I/O	MCU - 25, FPGA - 66
  Moisture Sensitivity Level (MSL)	3 (168 Hours)	Lead Free Status / RoHS Status	Contains lead / RoHS non-compliant
  Flash Size	512KB	Detailed Description	ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops 512KB 64KB 100MHz 256-FPBGA (17x17)
  Core Processor	ARM® Cortex®-M3	Connectivity	EBI/EMI, Ethernet, I²C, SPI, UART/USART
  Base Part Number	A2F500M3G	Architecture	MCU, FPGA

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