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M2S060TS-1FCSG325

M2S060TS-1FCSG325

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Microsemi

Specifications of M2S060TS-1FCSG325

Microsemi

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Part Number	M2S060TS-1FCSG325	Manufacturer	Microsemi
Description	IC FPGA SOC 60K LUTS	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	904 pcs stock	Data sheet	1.M2S060TS-1FCSG325.pdf2.M2S060TS-1FCSG325.pdf
Supplier Device Package	325-BGA (11x11)	Speed	166MHz
Series	SmartFusion®2	RAM Size	64KB
Primary Attributes	FPGA - 60K Logic Modules	Peripherals	DDR, PCIe, SERDES
Packaging	Tray	Package / Case	325-TFBGA
Operating Temperature	0°C ~ 85°C (TJ)	Number of I/O	200
Moisture Sensitivity Level (MSL)	3 (168 Hours)	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Flash Size	256KB	Detailed Description	ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 60K Logic Modules 256KB 64KB 166MHz 325-BGA (11x11)
Core Processor	ARM® Cortex®-M3	Connectivity	CANbus, Ethernet, I²C, SPI, UART/USART, USB
Architecture	MCU, FPGA

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• Part Number	M2S060TS-1FCSG325	Manufacturer	Microsemi
  Description	IC FPGA SOC 60K LUTS	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
  Quantity Available	904 pcs stock	Data sheet	1.M2S060TS-1FCSG325.pdf2.M2S060TS-1FCSG325.pdf
  Supplier Device Package	325-BGA (11x11)	Speed	166MHz
  Series	SmartFusion®2	RAM Size	64KB
  Primary Attributes	FPGA - 60K Logic Modules	Peripherals	DDR, PCIe, SERDES
  Packaging	Tray	Package / Case	325-TFBGA
  Operating Temperature	0°C ~ 85°C (TJ)	Number of I/O	200
  Moisture Sensitivity Level (MSL)	3 (168 Hours)	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
  Flash Size	256KB	Detailed Description	ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 60K Logic Modules 256KB 64KB 166MHz 325-BGA (11x11)
  Core Processor	ARM® Cortex®-M3	Connectivity	CANbus, Ethernet, I²C, SPI, UART/USART, USB
  Architecture	MCU, FPGA

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