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M2S090T-1FG676I

M2S090T-1FG676I

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Microsemi

Specifications of M2S090T-1FG676I

Microsemi

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Part Number	M2S090T-1FG676I	Manufacturer	Microsemi
Description	IC FPGA SOC 90K LUTS 676FBGA	Lead Free Status / RoHS Status	Contains lead / RoHS non-compliant
Quantity Available	363 pcs stock	Data sheet	1.M2S090T-1FG676I.pdf2.M2S090T-1FG676I.pdf
Supplier Device Package	676-FBGA (27x27)	Speed	166MHz
Series	SmartFusion®2	RAM Size	64KB
Primary Attributes	FPGA - 90K Logic Modules	Peripherals	DDR, PCIe, SERDES
Packaging	Tray	Package / Case	676-BGA
Operating Temperature	-40°C ~ 100°C (TJ)	Number of I/O	425
Moisture Sensitivity Level (MSL)	3 (168 Hours)	Lead Free Status / RoHS Status	Contains lead / RoHS non-compliant
Flash Size	512KB	Detailed Description	ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 90K Logic Modules 512KB 64KB 166MHz 676-FBGA (27x27)
Core Processor	ARM® Cortex®-M3	Connectivity	CANbus, Ethernet, I²C, SPI, UART/USART, USB
Base Part Number	M2S090T	Architecture	MCU, FPGA

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• Part Number	M2S090T-1FG676I	Manufacturer	Microsemi
  Description	IC FPGA SOC 90K LUTS 676FBGA	Lead Free Status / RoHS Status	Contains lead / RoHS non-compliant
  Quantity Available	363 pcs stock	Data sheet	1.M2S090T-1FG676I.pdf2.M2S090T-1FG676I.pdf
  Supplier Device Package	676-FBGA (27x27)	Speed	166MHz
  Series	SmartFusion®2	RAM Size	64KB
  Primary Attributes	FPGA - 90K Logic Modules	Peripherals	DDR, PCIe, SERDES
  Packaging	Tray	Package / Case	676-BGA
  Operating Temperature	-40°C ~ 100°C (TJ)	Number of I/O	425
  Moisture Sensitivity Level (MSL)	3 (168 Hours)	Lead Free Status / RoHS Status	Contains lead / RoHS non-compliant
  Flash Size	512KB	Detailed Description	ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 90K Logic Modules 512KB 64KB 166MHz 676-FBGA (27x27)
  Core Processor	ARM® Cortex®-M3	Connectivity	CANbus, Ethernet, I²C, SPI, UART/USART, USB
  Base Part Number	M2S090T	Architecture	MCU, FPGA

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