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Part Number | M2S090TS-1FGG676T2 | Manufacturer | Microsemi |
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Description | IC FPGA SOC | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Quantity Available | 295 pcs stock | Data sheet | 1.M2S090TS-1FGG676T2.pdf2.M2S090TS-1FGG676T2.pdf3.M2S090TS-1FGG676T2.pdf4.M2S090TS-1FGG676T2.pdf5.M2S090TS-1FGG676T2.pdf6.M2S090TS-1FGG676T2.pdf7.M2S090TS-1FGG676T2.pdf8.M2S090TS-1FGG676T2.pdf |
Supplier Device Package | 676-FBGA (27x27) | Speed | 166MHz |
Series | Automotive, AEC-Q100, SmartFusion®2 | RAM Size | 64KB |
Primary Attributes | FPGA - 90K Logic Modules | Peripherals | DDR, PCIe, SERDES |
Packaging | Tray | Package / Case | 676-BGA |
Operating Temperature | -40°C ~ 125°C (TJ) | Number of I/O | 425 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Flash Size | 512KB | Detailed Description | ARM® Cortex®-M3 System On Chip (SOC) IC Automotive, AEC-Q100, SmartFusion®2 FPGA - 90K Logic Modules 512KB 64KB 166MHz 676-FBGA (27x27) |
Core Processor | ARM® Cortex®-M3 | Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Architecture | MCU, FPGA |
FEDEX | www.FedEx.com | From $35.00 basic shipping fee depend on zone and country. |
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DHL | www.DHL.com | From $35.00 basic shipping fee depend on zone and country. |
UPS | www.UPS.com | From $35.00 basic shipping fee depend on zone and country. |
TNT | www.TNT.com | From $35.00 basic shipping fee depend on zone and country. |
Part Number | M2S090TS-1FGG676T2 | Manufacturer | Microsemi |
---|---|---|---|
Description | IC FPGA SOC | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Quantity Available | 295 pcs stock | Data sheet | 1.M2S090TS-1FGG676T2.pdf2.M2S090TS-1FGG676T2.pdf3.M2S090TS-1FGG676T2.pdf4.M2S090TS-1FGG676T2.pdf5.M2S090TS-1FGG676T2.pdf6.M2S090TS-1FGG676T2.pdf7.M2S090TS-1FGG676T2.pdf8.M2S090TS-1FGG676T2.pdf |
Supplier Device Package | 676-FBGA (27x27) | Speed | 166MHz |
Series | Automotive, AEC-Q100, SmartFusion®2 | RAM Size | 64KB |
Primary Attributes | FPGA - 90K Logic Modules | Peripherals | DDR, PCIe, SERDES |
Packaging | Tray | Package / Case | 676-BGA |
Operating Temperature | -40°C ~ 125°C (TJ) | Number of I/O | 425 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Flash Size | 512KB | Detailed Description | ARM® Cortex®-M3 System On Chip (SOC) IC Automotive, AEC-Q100, SmartFusion®2 FPGA - 90K Logic Modules 512KB 64KB 166MHz 676-FBGA (27x27) |
Core Processor | ARM® Cortex®-M3 | Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Architecture | MCU, FPGA |