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XA7Z010-1CLG225Q

XA7Z010-1CLG225Q

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Xilinx

Specifications of XA7Z010-1CLG225Q

Xilinx

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Part Number	XA7Z010-1CLG225Q	Manufacturer	Xilinx
Description	IC SOC CORTEX A-9 ZYNQ7 225BGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	1403 pcs stock	Data sheet	1.XA7Z010-1CLG225Q.pdf2.XA7Z010-1CLG225Q.pdf
Supplier Device Package	225-CSPBGA (13x13)	Speed	667MHz
Series	Automotive, AEC-Q100, Zynq®-7000 XA	RAM Size	256KB
Primary Attributes	Artix™-7 FPGA, 28K Logic Cells	Peripherals	DMA
Packaging	Tray	Package / Case	225-LFBGA, CSPBGA
Operating Temperature	-40°C ~ 125°C (TJ)	Number of I/O	86
Moisture Sensitivity Level (MSL)	3 (168 Hours)	Manufacturer Standard Lead Time	10 Weeks
Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	-
Detailed Description	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Automotive, AEC-Q100, Zynq®-7000 XA Artix™-7 FPGA, 28K Logic Cells 256KB 667MHz 225-CSPBGA (13x13)	Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Architecture	MCU, FPGA

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• Part Number	XA7Z010-1CLG225Q	Manufacturer	Xilinx
  Description	IC SOC CORTEX A-9 ZYNQ7 225BGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
  Quantity Available	1403 pcs stock	Data sheet	1.XA7Z010-1CLG225Q.pdf2.XA7Z010-1CLG225Q.pdf
  Supplier Device Package	225-CSPBGA (13x13)	Speed	667MHz
  Series	Automotive, AEC-Q100, Zynq®-7000 XA	RAM Size	256KB
  Primary Attributes	Artix™-7 FPGA, 28K Logic Cells	Peripherals	DMA
  Packaging	Tray	Package / Case	225-LFBGA, CSPBGA
  Operating Temperature	-40°C ~ 125°C (TJ)	Number of I/O	86
  Moisture Sensitivity Level (MSL)	3 (168 Hours)	Manufacturer Standard Lead Time	10 Weeks
  Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	-
  Detailed Description	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Automotive, AEC-Q100, Zynq®-7000 XA Artix™-7 FPGA, 28K Logic Cells 256KB 667MHz 225-CSPBGA (13x13)	Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Architecture	MCU, FPGA

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