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XC7Z007S-2CLG225E

XC7Z007S-2CLG225E

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Xilinx

Specifications of XC7Z007S-2CLG225E

Xilinx

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Part Number	XC7Z007S-2CLG225E	Manufacturer	Xilinx
Description	IC FPGA SOC 100I/O 225BGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	1674 pcs stock	Data sheet	1.XC7Z007S-2CLG225E.pdf2.XC7Z007S-2CLG225E.pdf3.XC7Z007S-2CLG225E.pdf
Supplier Device Package	225-CSPBGA (13x13)	Speed	766MHz
Series	Zynq®-7000	RAM Size	256KB
Primary Attributes	Artix™-7 FPGA, 23K Logic Cells	Peripherals	DMA
Packaging	Tray	Package / Case	225-LFBGA, CSPBGA
Other Names	122-2000	Operating Temperature	0°C ~ 100°C (TJ)
Number of I/O	54	Moisture Sensitivity Level (MSL)	3 (168 Hours)
Manufacturer Standard Lead Time	10 Weeks	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Flash Size	-	Detailed Description	Single ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Artix™-7 FPGA, 23K Logic Cells 256KB 766MHz 225-CSPBGA (13x13)
Core Processor	Single ARM® Cortex®-A9 MPCore™ with CoreSight™	Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA

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• Part Number	XC7Z007S-2CLG225E	Manufacturer	Xilinx
  Description	IC FPGA SOC 100I/O 225BGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
  Quantity Available	1674 pcs stock	Data sheet	1.XC7Z007S-2CLG225E.pdf2.XC7Z007S-2CLG225E.pdf3.XC7Z007S-2CLG225E.pdf
  Supplier Device Package	225-CSPBGA (13x13)	Speed	766MHz
  Series	Zynq®-7000	RAM Size	256KB
  Primary Attributes	Artix™-7 FPGA, 23K Logic Cells	Peripherals	DMA
  Packaging	Tray	Package / Case	225-LFBGA, CSPBGA
  Other Names	122-2000	Operating Temperature	0°C ~ 100°C (TJ)
  Number of I/O	54	Moisture Sensitivity Level (MSL)	3 (168 Hours)
  Manufacturer Standard Lead Time	10 Weeks	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
  Flash Size	-	Detailed Description	Single ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Artix™-7 FPGA, 23K Logic Cells 256KB 766MHz 225-CSPBGA (13x13)
  Core Processor	Single ARM® Cortex®-A9 MPCore™ with CoreSight™	Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  Architecture	MCU, FPGA

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