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XC7Z100-1FFG1156I

XC7Z100-1FFG1156I

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Xilinx

Specifications of XC7Z100-1FFG1156I

Xilinx

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Part Number	XC7Z100-1FFG1156I	Manufacturer	Xilinx
Description	IC SOC CORTEX A-9 ZYNQ7 1156BGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	39 pcs stock	Data sheet	1.XC7Z100-1FFG1156I.pdf2.XC7Z100-1FFG1156I.pdf3.XC7Z100-1FFG1156I.pdf
Supplier Device Package	1156-FCBGA (35x35)	Speed	667MHz
Series	Zynq®-7000	RAM Size	256KB
Primary Attributes	Kintex™-7 FPGA, 444K Logic Cells	Peripherals	DMA
Packaging	Tray	Package / Case	1156-BBGA, FCBGA
Operating Temperature	-40°C ~ 100°C (TJ)	Number of I/O	250
Moisture Sensitivity Level (MSL)	4 (72 Hours)	Manufacturer Standard Lead Time	10 Weeks
Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	-
Detailed Description	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 444K Logic Cells 256KB 667MHz 1156-FCBGA (35x35)	Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Architecture	MCU, FPGA

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• Part Number	XC7Z100-1FFG1156I	Manufacturer	Xilinx
  Description	IC SOC CORTEX A-9 ZYNQ7 1156BGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
  Quantity Available	39 pcs stock	Data sheet	1.XC7Z100-1FFG1156I.pdf2.XC7Z100-1FFG1156I.pdf3.XC7Z100-1FFG1156I.pdf
  Supplier Device Package	1156-FCBGA (35x35)	Speed	667MHz
  Series	Zynq®-7000	RAM Size	256KB
  Primary Attributes	Kintex™-7 FPGA, 444K Logic Cells	Peripherals	DMA
  Packaging	Tray	Package / Case	1156-BBGA, FCBGA
  Operating Temperature	-40°C ~ 100°C (TJ)	Number of I/O	250
  Moisture Sensitivity Level (MSL)	4 (72 Hours)	Manufacturer Standard Lead Time	10 Weeks
  Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	-
  Detailed Description	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 444K Logic Cells 256KB 667MHz 1156-FCBGA (35x35)	Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Architecture	MCU, FPGA

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