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XC7Z100-2FF900I

XC7Z100-2FF900I

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Xilinx

Part Number:: XC7Z100-2FF900I

Manufacturer/Brand:: Xilinx

Product Description:: XC7Z100-2FF900I

Datasheets:: 1.XC7Z100-2FF900I.pdf 2.XC7Z100-2FF900I.pdf

RoHs Status:: Not applicable / Not applicable

Stock Condition:: 28 pcs stock

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Shipment Way:: DHL/Fedex/TNT/UPS/EMS

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In Stock 28 pcs Reference Price(In US Dollars)

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XC7Z100-2FF900I

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Specifications of XC7Z100-2FF900I

Xilinx

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Part Number	XC7Z100-2FF900I	Manufacturer	Xilinx
Description	XC7Z100-2FF900I	Lead Free Status / RoHS Status	Not applicable / Not applicable
Quantity Available	28 pcs stock	Data sheet	1.XC7Z100-2FF900I.pdf 2.XC7Z100-2FF900I.pdf
Supplier Device Package	900-FCBGA (31x31)	Speed	800MHz
Series	Zynq®-7000	RAM Size	256KB
Primary Attributes	Kintex™-7 FPGA, 444K Logic Cells	Peripherals	DMA
Packaging	Tray	Package / Case	900-BBGA, FCBGA
Operating Temperature	-40°C ~ 100°C (TJ)	Number of I/O	212
Moisture Sensitivity Level (MSL)	4 (72 Hours)	Manufacturer Standard Lead Time	11 Weeks
Lead Free Status / RoHS Status	Not applicable / Not applicable	Flash Size	-
Detailed Description	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 444K Logic Cells 256KB 800MHz 900-FCBGA (31x31)	Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Architecture	MCU, FPGA

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Part Number	XC7Z100-2FF900I	Manufacturer	Xilinx
Description	XC7Z100-2FF900I	Lead Free Status / RoHS Status	Not applicable / Not applicable
Quantity Available	28 pcs stock	Data sheet	1.XC7Z100-2FF900I.pdf 2.XC7Z100-2FF900I.pdf
Supplier Device Package	900-FCBGA (31x31)	Speed	800MHz
Series	Zynq®-7000	RAM Size	256KB
Primary Attributes	Kintex™-7 FPGA, 444K Logic Cells	Peripherals	DMA
Packaging	Tray	Package / Case	900-BBGA, FCBGA
Operating Temperature	-40°C ~ 100°C (TJ)	Number of I/O	212
Moisture Sensitivity Level (MSL)	4 (72 Hours)	Manufacturer Standard Lead Time	11 Weeks
Lead Free Status / RoHS Status	Not applicable / Not applicable	Flash Size	-
Detailed Description	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 444K Logic Cells 256KB 800MHz 900-FCBGA (31x31)	Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Architecture	MCU, FPGA