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XCZU11EG-2FFVC1156E

XCZU11EG-2FFVC1156E

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Xilinx

Part Number:: XCZU11EG-2FFVC1156E

Manufacturer/Brand:: Xilinx

Product Description:: IC FPGA 360 I/O 1156FCBGA

Datasheets:: XCZU11EG-2FFVC1156E.pdf

RoHs Status:: Lead free / RoHS Compliant

Stock Condition:: 22 pcs stock

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Shipment Way:: DHL/Fedex/TNT/UPS/EMS

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In Stock 22 pcs Reference Price(In US Dollars)

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XCZU11EG-2FFVC1156E

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Specifications of XCZU11EG-2FFVC1156E

Xilinx

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Part Number	XCZU11EG-2FFVC1156E	Manufacturer	Xilinx
Description	IC FPGA 360 I/O 1156FCBGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	22 pcs stock	Data sheet	XCZU11EG-2FFVC1156E.pdf
Supplier Device Package	1156-FCBGA (35x35)	Speed	533MHz, 600MHz, 1.3GHz
Series	Zynq® UltraScale+™ MPSoC EG	RAM Size	256KB
Primary Attributes	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	Peripherals	DMA, WDT
Packaging	Tray	Package / Case	1156-BBGA, FCBGA
Operating Temperature	0°C ~ 100°C (TJ)	Number of I/O	360
Moisture Sensitivity Level (MSL)	4 (72 Hours)	Manufacturer Standard Lead Time	10 Weeks
Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	-
Detailed Description	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 653K+ Logic Cells 256KB 533MHz, 600MHz, 1.3GHz 1156-FCBGA (35x35)	Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Architecture	MCU, FPGA

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Part Number	XCZU11EG-2FFVC1156E	Manufacturer	Xilinx
Description	IC FPGA 360 I/O 1156FCBGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	22 pcs stock	Data sheet	XCZU11EG-2FFVC1156E.pdf
Supplier Device Package	1156-FCBGA (35x35)	Speed	533MHz, 600MHz, 1.3GHz
Series	Zynq® UltraScale+™ MPSoC EG	RAM Size	256KB
Primary Attributes	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	Peripherals	DMA, WDT
Packaging	Tray	Package / Case	1156-BBGA, FCBGA
Operating Temperature	0°C ~ 100°C (TJ)	Number of I/O	360
Moisture Sensitivity Level (MSL)	4 (72 Hours)	Manufacturer Standard Lead Time	10 Weeks
Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	-
Detailed Description	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 653K+ Logic Cells 256KB 533MHz, 600MHz, 1.3GHz 1156-FCBGA (35x35)	Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Architecture	MCU, FPGA