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Part Number | XCZU2EG-L1SFVC784I | Manufacturer | Xilinx |
---|---|---|---|
Description | IC FPGA 252 I/O 784FCBGA | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Quantity Available | 251 pcs stock | Data sheet | 1.XCZU2EG-L1SFVC784I.pdf2.XCZU2EG-L1SFVC784I.pdf3.XCZU2EG-L1SFVC784I.pdf4.XCZU2EG-L1SFVC784I.pdf |
Supplier Device Package | 784-FCBGA (23x23) | Speed | 500MHz, 600MHz, 1.2GHz |
Series | Zynq® UltraScale+™ MPSoC EG | RAM Size | 256KB |
Primary Attributes | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | Peripherals | DMA, WDT |
Packaging | Tray | Package / Case | 784-BBGA, FCBGA |
Other Names | 122-2057 XCZU2EG-L1SFVC784I-ND | Operating Temperature | -40°C ~ 100°C (TJ) |
Number of I/O | 252 | Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Manufacturer Standard Lead Time | 10 Weeks | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Flash Size | - | Detailed Description | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 103K+ Logic Cells 256KB 500MHz, 600MHz, 1.2GHz 784-FCBGA (23x23) |
Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture | MCU, FPGA |
FEDEX | www.FedEx.com | From $35.00 basic shipping fee depend on zone and country. |
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DHL | www.DHL.com | From $35.00 basic shipping fee depend on zone and country. |
UPS | www.UPS.com | From $35.00 basic shipping fee depend on zone and country. |
TNT | www.TNT.com | From $35.00 basic shipping fee depend on zone and country. |
Part Number | XCZU2EG-L1SFVC784I | Manufacturer | Xilinx |
---|---|---|---|
Description | IC FPGA 252 I/O 784FCBGA | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Quantity Available | 251 pcs stock | Data sheet | 1.XCZU2EG-L1SFVC784I.pdf2.XCZU2EG-L1SFVC784I.pdf3.XCZU2EG-L1SFVC784I.pdf4.XCZU2EG-L1SFVC784I.pdf |
Supplier Device Package | 784-FCBGA (23x23) | Speed | 500MHz, 600MHz, 1.2GHz |
Series | Zynq® UltraScale+™ MPSoC EG | RAM Size | 256KB |
Primary Attributes | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | Peripherals | DMA, WDT |
Packaging | Tray | Package / Case | 784-BBGA, FCBGA |
Other Names | 122-2057 XCZU2EG-L1SFVC784I-ND | Operating Temperature | -40°C ~ 100°C (TJ) |
Number of I/O | 252 | Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Manufacturer Standard Lead Time | 10 Weeks | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Flash Size | - | Detailed Description | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 103K+ Logic Cells 256KB 500MHz, 600MHz, 1.2GHz 784-FCBGA (23x23) |
Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture | MCU, FPGA |