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Part Number | XCZU3EG-L2SFVA625E | Manufacturer | Xilinx |
---|---|---|---|
Description | IC FPGA 180 I/O 625FCBGA | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Quantity Available | 137 pcs stock | Data sheet | 1.XCZU3EG-L2SFVA625E.pdf2.XCZU3EG-L2SFVA625E.pdf3.XCZU3EG-L2SFVA625E.pdf4.XCZU3EG-L2SFVA625E.pdf |
Supplier Device Package | 625-FCBGA (21x21) | Speed | 533MHz, 600MHz, 1.3GHz |
Series | Zynq® UltraScale+™ MPSoC EG | RAM Size | 256KB |
Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | Peripherals | DMA, WDT |
Packaging | Tray | Package / Case | 625-BFBGA, FCBGA |
Operating Temperature | 0°C ~ 100°C (TJ) | Number of I/O | 180 |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) | Manufacturer Standard Lead Time | 10 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | Flash Size | - |
Detailed Description | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 256KB 533MHz, 600MHz, 1.3GHz 625-FCBGA (21x21) | Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Architecture | MCU, FPGA |
FEDEX | www.FedEx.com | From $35.00 basic shipping fee depend on zone and country. |
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DHL | www.DHL.com | From $35.00 basic shipping fee depend on zone and country. |
UPS | www.UPS.com | From $35.00 basic shipping fee depend on zone and country. |
TNT | www.TNT.com | From $35.00 basic shipping fee depend on zone and country. |
Part Number | XCZU3EG-L2SFVA625E | Manufacturer | Xilinx |
---|---|---|---|
Description | IC FPGA 180 I/O 625FCBGA | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Quantity Available | 137 pcs stock | Data sheet | 1.XCZU3EG-L2SFVA625E.pdf2.XCZU3EG-L2SFVA625E.pdf3.XCZU3EG-L2SFVA625E.pdf4.XCZU3EG-L2SFVA625E.pdf |
Supplier Device Package | 625-FCBGA (21x21) | Speed | 533MHz, 600MHz, 1.3GHz |
Series | Zynq® UltraScale+™ MPSoC EG | RAM Size | 256KB |
Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | Peripherals | DMA, WDT |
Packaging | Tray | Package / Case | 625-BFBGA, FCBGA |
Operating Temperature | 0°C ~ 100°C (TJ) | Number of I/O | 180 |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) | Manufacturer Standard Lead Time | 10 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | Flash Size | - |
Detailed Description | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 256KB 533MHz, 600MHz, 1.3GHz 625-FCBGA (21x21) | Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Architecture | MCU, FPGA |