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Part Number | XCZU4EV-L1SFVC784I | Manufacturer | Xilinx |
---|---|---|---|
Description | IC FPGA 252 I/O 784FCBGA | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Quantity Available | 75 pcs stock | Data sheet | 1.XCZU4EV-L1SFVC784I.pdf2.XCZU4EV-L1SFVC784I.pdf3.XCZU4EV-L1SFVC784I.pdf4.XCZU4EV-L1SFVC784I.pdf |
Supplier Device Package | 784-FCBGA (23x23) | Speed | 500MHz, 600MHz, 1.2GHz |
Series | Zynq® UltraScale+™ MPSoC EV | RAM Size | 256KB |
Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | Peripherals | DMA, WDT |
Packaging | Tray | Package / Case | 784-BBGA, FCBGA |
Operating Temperature | -40°C ~ 100°C (TJ) | Number of I/O | 252 |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) | Manufacturer Standard Lead Time | 10 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | Flash Size | - |
Detailed Description | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EV Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 256KB 500MHz, 600MHz, 1.2GHz 784-FCBGA (23x23) | Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Architecture | MCU, FPGA |
FEDEX | www.FedEx.com | From $35.00 basic shipping fee depend on zone and country. |
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DHL | www.DHL.com | From $35.00 basic shipping fee depend on zone and country. |
UPS | www.UPS.com | From $35.00 basic shipping fee depend on zone and country. |
TNT | www.TNT.com | From $35.00 basic shipping fee depend on zone and country. |
Part Number | XCZU4EV-L1SFVC784I | Manufacturer | Xilinx |
---|---|---|---|
Description | IC FPGA 252 I/O 784FCBGA | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Quantity Available | 75 pcs stock | Data sheet | 1.XCZU4EV-L1SFVC784I.pdf2.XCZU4EV-L1SFVC784I.pdf3.XCZU4EV-L1SFVC784I.pdf4.XCZU4EV-L1SFVC784I.pdf |
Supplier Device Package | 784-FCBGA (23x23) | Speed | 500MHz, 600MHz, 1.2GHz |
Series | Zynq® UltraScale+™ MPSoC EV | RAM Size | 256KB |
Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | Peripherals | DMA, WDT |
Packaging | Tray | Package / Case | 784-BBGA, FCBGA |
Operating Temperature | -40°C ~ 100°C (TJ) | Number of I/O | 252 |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) | Manufacturer Standard Lead Time | 10 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | Flash Size | - |
Detailed Description | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EV Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 256KB 500MHz, 600MHz, 1.2GHz 784-FCBGA (23x23) | Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Architecture | MCU, FPGA |