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5CSXFC6D6F31A7N

5CSXFC6D6F31A7N

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Intel® FPGAs

Part Number:: 5CSXFC6D6F31A7N

Manufacturer/Brand:: Intel® FPGAs

Product Description:: IC FPGA 288 I/O 896FBGA

Datasheets:: 1.5CSXFC6D6F31A7N.pdf 2.5CSXFC6D6F31A7N.pdf 3.5CSXFC6D6F31A7N.pdf 4.5CSXFC6D6F31A7N.pdf

RoHs Status:: Lead free / RoHS Compliant

Stock Condition:: 222 pcs stock

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Shipment Way:: DHL/Fedex/TNT/UPS/EMS

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In Stock 222 pcs Reference Price(In US Dollars)

27 pcs
$139.744

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5CSXFC6D6F31A7N

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Specifications of 5CSXFC6D6F31A7N

Intel® FPGAs

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Part Number	5CSXFC6D6F31A7N	Manufacturer	Intel® FPGAs
Description	IC FPGA 288 I/O 896FBGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	222 pcs stock	Data sheet	1.5CSXFC6D6F31A7N.pdf 2.5CSXFC6D6F31A7N.pdf 3.5CSXFC6D6F31A7N.pdf 4.5CSXFC6D6F31A7N.pdf
Supplier Device Package	896-FBGA (31x31)	Speed	700MHz
Series	Automotive, AEC-Q100, Cyclone® V SE	RAM Size	64KB
Primary Attributes	FPGA - 110K Logic Elements	Peripherals	DMA, POR, WDT
Packaging	Tray	Package / Case	896-BGA
Operating Temperature	-40°C ~ 125°C (TJ)	Number of I/O	MCU - 181, FPGA - 288
Moisture Sensitivity Level (MSL)	3 (168 Hours)	Manufacturer Standard Lead Time	8 Weeks
Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	-
Detailed Description	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Automotive, AEC-Q100, Cyclone® V SE FPGA - 110K Logic Elements 64KB 700MHz 896-FBGA (31x31)	Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Architecture	MCU, FPGA

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Part Number	5CSXFC6D6F31A7N	Manufacturer	Intel® FPGAs
Description	IC FPGA 288 I/O 896FBGA	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Quantity Available	222 pcs stock	Data sheet	1.5CSXFC6D6F31A7N.pdf 2.5CSXFC6D6F31A7N.pdf 3.5CSXFC6D6F31A7N.pdf 4.5CSXFC6D6F31A7N.pdf
Supplier Device Package	896-FBGA (31x31)	Speed	700MHz
Series	Automotive, AEC-Q100, Cyclone® V SE	RAM Size	64KB
Primary Attributes	FPGA - 110K Logic Elements	Peripherals	DMA, POR, WDT
Packaging	Tray	Package / Case	896-BGA
Operating Temperature	-40°C ~ 125°C (TJ)	Number of I/O	MCU - 181, FPGA - 288
Moisture Sensitivity Level (MSL)	3 (168 Hours)	Manufacturer Standard Lead Time	8 Weeks
Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Flash Size	-
Detailed Description	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Automotive, AEC-Q100, Cyclone® V SE FPGA - 110K Logic Elements 64KB 700MHz 896-FBGA (31x31)	Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Architecture	MCU, FPGA