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A2F060M3E-FG256

A2F060M3E-FG256

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Microsemi

Specifications of A2F060M3E-FG256

Microsemi

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Part Number	A2F060M3E-FG256	Manufacturer	Microsemi
Description	IC FPGA 60K GATES 128KB 256FBGA	Lead Free Status / RoHS Status	Contains lead / RoHS non-compliant
Quantity Available	4673 pcs stock	Data sheet	A2F060M3E-FG256.pdf
Supplier Device Package	256-FPBGA (17x17)	Speed	80MHz
Series	SmartFusion®	RAM Size	16KB
Primary Attributes	ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops	Peripherals	DMA, POR, WDT
Packaging	Tray	Package / Case	256-LBGA
Operating Temperature	0°C ~ 85°C (TJ)	Number of I/O	MCU - 26, FPGA - 66
Moisture Sensitivity Level (MSL)	3 (168 Hours)	Lead Free Status / RoHS Status	Contains lead / RoHS non-compliant
Flash Size	128KB	Detailed Description	ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops 128KB 16KB 80MHz 256-FPBGA (17x17)
Core Processor	ARM® Cortex®-M3	Connectivity	EBI/EMI, I²C, SPI, UART/USART
Base Part Number	A2F060M3E	Architecture	MCU, FPGA

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• Part Number	A2F060M3E-FG256	Manufacturer	Microsemi
  Description	IC FPGA 60K GATES 128KB 256FBGA	Lead Free Status / RoHS Status	Contains lead / RoHS non-compliant
  Quantity Available	4673 pcs stock	Data sheet	A2F060M3E-FG256.pdf
  Supplier Device Package	256-FPBGA (17x17)	Speed	80MHz
  Series	SmartFusion®	RAM Size	16KB
  Primary Attributes	ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops	Peripherals	DMA, POR, WDT
  Packaging	Tray	Package / Case	256-LBGA
  Operating Temperature	0°C ~ 85°C (TJ)	Number of I/O	MCU - 26, FPGA - 66
  Moisture Sensitivity Level (MSL)	3 (168 Hours)	Lead Free Status / RoHS Status	Contains lead / RoHS non-compliant
  Flash Size	128KB	Detailed Description	ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops 128KB 16KB 80MHz 256-FPBGA (17x17)
  Core Processor	ARM® Cortex®-M3	Connectivity	EBI/EMI, I²C, SPI, UART/USART
  Base Part Number	A2F060M3E	Architecture	MCU, FPGA

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